EL5175, EL5375
Typical Performance Curves (Continued)
M = 100ns
CH1 = 200mV/DIV
CH2 = 5V/DIV
CH1
CH2
M = 400ns
CH1 = 200mV/DIV
CH2 = 5V/DIV
CH1
CH2
100ns/DIV
FIGURE 21. ENABLED RESPONSE
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
1.2 CONDUCTIVITY TEST BOARD
1.0
870mW
0.8
625mW
0.6
0.4 486mW
QSOP24
JA = +115°C/W
SO8
JA = +160°C/W
MSOP8
0.2
JA = +206°C/W
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 23. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
Simplified Schematic
I1
I2
RD1
VS+
I3
I4
RD2
VIN+
VIN-
VREF
FB
Q1
Q2
Q3
Q4
400ns/DIV
FIGURE 22. DISABLED RESPONSE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
1.4 CONDUCTIVITY TEST BOARD
1.2 1.136W
1.0 909mW
QSOP24
JA = +88°C/W
0.8 870mW
0.6
MSOP8
JA = +115°C/W
0.4
SO8
JA = +110°C/W
0.2
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 24. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
R3
R4
Q8
Q7
VB1
Q9
25
Q6
VB2
R1
R2
VS-
x1
VOUT
CC
FN7306 Rev 7.00
August 25, 2010
Page 9 of 15