GRM21BR71A106KE51 데이터 시트보기 (PDF) - ON Semiconductor
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GRM21BR71A106KE51 Datasheet PDF : 16 Pages
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NCP6323, NCV6323
Vo = 0.6V to Vin 1uH
Cout
10uF
Cfb
R1
R2
NCP/NCV6323
PGND PVIN
SW
AVIN
AGND PG
FB
EN
Vin = 2.5 V to 5.5 V
Cin
10uF
Rpg
1M
Power Good
Enable
(a) Power Good Output Option (NCP/NCV6323)
Figure 1. Typical Application Circuit
PIN DESCRIPTION
Pin
Name
1
PGND
2
SW
3
AGND
4
FB
5
EN
6
PG
7
AVIN
Type
Power
Ground
Power
Output
Analog
Ground
Analog
Input
Digital
Input
Digital
Output
Analog
Input
8
PVIN
Power
Input
9
PAD
Exposed
Pad
Description
Power Ground for power, analog blocks. Must be connected to the system ground.
Switch Power pin connects power transistors to one end of the inductor.
Analog Ground analog and digital blocks. Must be connected to the system ground.
Feedback Voltage from the buck converter output. This is the input to the error amplifier. This pin
is connected to the resistor divider network between the output and AGND.
Enable of the IC. High level at this pin enables the device. Low level at this pin disables the de-
vice.
It is open drain output. Low level at this pin indicates the device is not in power good, while high
impedance at this pin indicates the device is in power good.
Analog Supply. This pin is the analog and the digital supply of the device. An optional 1 mF or lar-
ger ceramic capacitor bypasses this input to the ground. This capacitor should be placed as close
as possible to this input.
Power Supply Input. This pin is the power supply of the device. A 10 mF or larger ceramic capacit-
or must bypass this input to the ground. This capacitor should be placed as close a possible to
this input.
Exposed Pad. Must be soldered to system ground to achieve power dissipation performances.
This pin is internally unconnected
ORDERING INFORMATION
Device
Marking
Package
Shipping†
NCP6323DMTAATBG
NN
WDFN8
(Pb−Free)
3000 / Tape & Reel
NCV6323BMTAATBG
23
WDFN8
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
2
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