2SK4005-01MR 데이터 시트보기 (PDF) - Fuji Electric

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2SK4005-01MR

Power MOSFET

Fuji Electric 

･ Before touching a MOSFET terminal, Discharge any static electricity from your body and clothes by

grounding out through a high impedance resistor (about 1M)

･ When soldering, in order to protect the MOSFETs from static electricity, ground the soldering iron or

soldering bath through a low impedance resistor.

･ You must design the MOSFETs to be operated within the specified maximum ratings(voltage, current,

temperature, etc.) to prevent possible failure or destruction of devices.

･ Consider the possible temperature rise not only for the channel and case, but also for the outer leads.

･ Do not directly touch the leads or package of the MOSFETs while power is supplied or during operation in

order to avoid electric shock and burns.

･ The MOSFETs are made of incombustible material. However, if a MOSFET fails, it may emit smoke or

flame. Also, operating the MOSFETs near any flammable place or material may cause the MOSFETs to

emit smoke or flame in case the MOSFETs become even hotter during operation. Design the arrangement

to prevent the spread of fire.

･ The MOSFETs should not used in an environment in the presence of acid, organic matter, or corrosive

gas(hydrogen sulfide, sulfurous acid gas etc.)

･ The MOSFETs should not used in an irradiated environment since they are not radiation-proof.

Installation

･ Soldering involves temperatures which exceed the device storage temperature rating. To avoid device

damage and to ensure reliability, observe the following guidelines from the quality assurance standard.

Solder temperature and duration (through-hole package)

Solder temperature

2605 C

35010 C

Duration

101 seconds

3.50.5 seconds

･ The immersion depth of the lead should basically be up to the lead stopper and the distance should be a

maximum of 1.5mm from the device.

･ When flow-soldering, be careful to avoid immersing the package in the solder bath.

･ Refer to the following torque reference when mounting the device on a heat sink. Excess torque applied to

the mounting screw causes damage to the device and weak torque will increase the thermal resistance,

both of which conditions may destroy the device.

Table 1: Recommended tightening torques.

Package style

TO-220

TO-220F

TO-3P

TO-3PF

TO-247

TO-3PL

Screw

M3

M3

M3

Tightening torques

30 –50 Ncm

40 –60 Ncm

60 –80 Ncm

Note

flatness : < =±30m

roughness : <=10m

Plane off the edges :

C<=1.0mm

Fuji Electric Device Technology Co.,Ltd.

MS5F5984 10 / 18

H04-004-03

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