Solder Pad Design
Figure 3. Recommended PCB footprint for LUXEON Z ES for high
component count density based on solder mask defined pads. Dimensions in mm.
Figure 4. Solder pad layout for LUXEON Z.
Notes for Figures 3 and 4:
1. The drawing above shows the recommended solder pad layout on Printed Circuit Board (PCB).
2. Application Brief AB120 (LUXEON Z ES) and AB105 (LUXEON Z) provide the details of the PCB board layout design. In addition, the .dwg files are available at
www.philipslumileds.com and www.philipslumileds.cn.com.
LUXEON Z and LUXEON Z ES Datasheet DS120 20140326 ©2014 Philips Lumileds Lighting Company.
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