5962-8852502XX 데이터 시트보기 (PDF) - Atmel Corporation
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5962-8852502XX Datasheet PDF : 27 Pages
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27. Ordering Information(2)
27.1 Standard Package
tACC
ICC (mA)
(ns)
Active Standby
150
50
0.2
0.3
200
50
0.3
250
50
0.3
Ordering Code
AT28C256(E,F)-15JI
AT28C256(E,F)-15PI
AT28C256(E,F)-15SI
AT28C256(E,F)-15TI
AT28C256(E,F)-15DM/883
AT28C256(E,F)-15FM/883
AT28C256(E,F)-15LM/883
AT28C256(E,F)-15UM/883
AT28C256(E,F)-20DM/883
AT28C256(E,F)-20FM/883
AT28C256(E,F)-20LM/883
AT28C256(E,F)-20UM/883
AT28C256(E,F)-25DM/883
AT28C256(E,F)-25FM/883
AT28C256(E,F)-25LM/883
AT28C256(E,F)-25UM/883
AT28C256(E,F)-35UM/883
Package
32J
28P6
28S
28T
28D6
28F
32L
28U
28D6
28F
32L
28U
28D6
28F
32L
28U
28U
AT28C256
Operation Range
Industrial
(-40° C to 85° C)
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
Military/883C
Class B, Fully Compliant
(-55° C to 125° C)
28D6
28F
32J
32L
28P6
28S
28T
28U
W
Blank
E
F
Package Type
28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip)
28-lead, Non-windowed, Ceramic Bottom-brazed Flat Package (Flatpack)
32-lead, Plastic J-leaded Chip Carrier (PLCC)
32-pad, Non-windowed, Ceramic Leadless Chip Carrier (LCC)
28-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)
28-lead, Plastic Thin Small Outline Package (TSOP)
28-pin, Ceramic Pin Grid Array (PGA)
Die
Options
Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms
High Endurance Option: Endurance = 100K Write Cycles
Fast Write Option: Write Time = 3 ms
13
0006K–PEEPR–01/08
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