2.2 Mechanical Dimensions
Figure 50 provides the mechanical dimensions, top surface, side profile, and pinout for the MPC5200B, 272 TE-PBGA
package.
PIN A1
INDEX
D
C
4X
0.2
A
272X
0.2 A
E
E2
0.35 A
B
19X e
(E1)
4X e /2
D2
TOP VIEW
(D1)
19X e
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
BOTTOM VIEW
0.2 M A B C
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER PARALLEL TO
PRIMARY DATUM A.
4. PRIMARY DATUM A AND THE SEATING PLANE
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A 2.05 2.65
A1 0.50 0.70
A2 0.50 0.70
A3 1.05 1.25
b 0.60 0.90
D 27.00 BSC
D1 24.13 REF
D2 23.30 24.70
E 27.00 BSC
E1 24.13 REF
E2 23.30 24.70
e
1.27 BSC
A1
A3
A2
A
SIDE VIEW
272X b 3
0.3 M A B C
0.15 M A
CASE 1135A–01
ISSUE B
DATE 10/15/1997
Figure 50. Mechanical Dimensions and Pinout Assignments for the MPC5200B, 272 TE-PBGA
MPC5200B Data Sheet, Rev. 4
58
Freescale Semiconductor