MCR225−8FP, MCR225−10FP
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case
Thermal Resistance, Case to Sink
Thermal Resistance, Junction to Ambient
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds
Symbol
RθJC
RθCS
RθJA
TL
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)
Characteristic
Symbol
Min
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current
(VD = Rated VDRM, VRRM; Gate Open)
TJ = 25°C
TJ = 125°C
ON CHARACTERISTICS
Peak Forward On−State Voltage(1)
(ITM = 50 A)
Gate Trigger Current (Continuous dc)
(VAK = 12 Vdc, RL = 100 Ohms)
Gate Trigger Voltage (Continuous dc)
(VAK = 12 Vdc, RL = 100 Ohms)
Gate Non-Trigger Voltage
(VAK = 12 Vdc, RL = 100 Ohms, TJ = 125°C)
Holding Current
(VAK = 12 Vdc, Initiating Current = 200 mA, Gate Open)
Turn-On Time
(ITM = 25 A, IGT = 40 mAdc)
Turn-Off Time (VDRM = Rated Voltage)
(ITM = 25 A, IR = 25 A)
(ITM = 25 A, IR = 25 A, TJ = 125°C)
DYNAMIC CHARACTERISTICS
IDRM,
IRRM
—
—
VTM
—
IGT
—
VGT
—
VGD
0.2
IH
—
tgt
—
tq
—
—
Critical Rate-of-Rise of Off-State Voltage
(Gate Open, VD = Rated VDRM, Exponential Waveform)
(1) Pulse Test: Pulse Width = 1.0 ms, Duty Cycle ≤ 2%.
dv/dt
—
Max
1.5
2.2 (typ)
60
260
Unit
°C/W
°C/W
°C/W
°C
Typ
Max
Unit
—
10
μA
—
2
mA
—
1.8
Volts
—
40
mA
0.8
1.5
Volts
—
—
Volts
20
40
mA
1.5
—
μs
μs
15
—
35
—
100
—
V/μs
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