MC74AC4040
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
VI
VO
IIK
IOK
IO
ICC
IGND
TSTG
TL
TJ
qJA
PD
MSL
DC Supply Voltage
DC Input Voltage
DC Output Voltage (Note 1)
DC Input Diode Current
DC Output Diode Current
DC Output Sink/Source Current
DC Supply Current per Output Pin
DC Ground Current per Output Pin
Storage Temperature Range
Lead temperature, 1 mm from Case for 10 Seconds
Junction temperature under Bias
Thermal Resistance (Note 2)
Power Dissipation in Still Air at 65°C (Note 3)
Moisture Sensitivity
−0.5 to +7.0
*0.5 ≤ VCC +0.5
*0.5 ≤ VCC +0.5
±20
±50
±50
±50
±50
−65 to +150
260
+150
69.1
500
Level 1
V
V
V
mA
mA
mA
mA
mA
°C
°C
°C
°C/W
mW
FR
VESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 30% − 35%
UL 94 V−0 @ 0.125 in
Human Body Model (Note 4)
> 2000
V
Machine Model (Note 5)
> 200
Charged Device Model (Note 6)
> 1000
ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 7)
±100
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. IO absolute maximum rating must be observed.
2. The package thermal impedance is calculated in accordance with JESD51−7.
3. 500 mW at 65°C; derate to 300 mW by 10 mW/ from 65°C to 85°C.
4. Tested to EIA/JESD22−A114−A.
5. Tested to EIA/JESD22−A115−A.
6. Tested to JESD22−C101−A.
7. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
VIN/VOUT Input Voltage, Output Voltage (Referenced to GND)
0
VCC
−
TA
Operating Temperature, All Package Types
−40
+85
°C
tr/tf
Input Rise/Fall Time
VCC = 3.0 V
(Figure 1)
VCC = 4.5 V
VCC = 5.5 V
0
150
ns/V
0
40
0
25
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
www.onsemi.com
3