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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

LTC3603IUF(RevA) 데이터 시트보기 (PDF) - Linear Technology

부품명
상세내역
제조사
LTC3603IUF
(Rev.:RevA)
Linear
Linear Technology 
LTC3603IUF Datasheet PDF : 22 Pages
First Prev 11 12 13 14 15 16 17 18 19 20 Next Last
LTC3603
PACKAGE DESCRIPTION
UF Package
20-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1710 Rev A)
4.50 p 0.05
3.10 p 0.05
2.00 REF
2.45 p 0.05
2.45 p 0.05
0.70 p0.05
PACKAGE OUTLINE
0.25 p0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 p 0.10
0.75 p 0.05
R = 0.05
TYP
PIN 1
TOP MARK
(NOTE 6)
4.00 p 0.10
2.00 REF
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
19 20
PIN 1 NOTCH
R = 0.20 TYP
OR 0.35 s 45o
CHAMFER
0.40 p 0.10
1
2.45 p 0.10
2
2.45 p 0.10
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING IS PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220
VARIATION (WGGD-1)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
(UF20) QFN 01-07 REV A
0.25 p 0.05
0.50 BSC
3603fa
20

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