Thermal Specifications and Design Considerations
Table 18.
Power Specifications for the Dual-core Low Voltage Processor
Symbol
Processor
Number
Core Frequency &
Voltage
Thermal Design
Power
Unit
Notes
TDP
L7400
L7200
Symbol
1.50 GHz & HFM VCC
1.33 GHz & HFM VCC
1.00 GHz & LFM VCC
Parameter
17
17
15.1
Min Typ Max
W
Unit
1, 4, 7
PAH,
PSGNT
PSLP
PDSLP
PDPRSLP
PDC4
TJ
Auto Halt, Stop Grant Power
at HFM VCC
at LFM VCC
Sleep Power
at HFM VCC
at LFM VCC
Deep Sleep Power
at HFM VCC
at LFM VCC
Deeper Sleep Power
Intel Enhanced Deeper Sleep Power
Junction Temperature
5.2
W
4.6
2, 8
4.9
W
4.4
2, 8
2.9
W
2.8
2, 9
1.5
W
2, 9
0.9
W
2, 9
0
100
°C
3, 4
NOTES:
1.
The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the maximum TJ has been reached.
Refer to Section 5.1 for more details.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specifications.
5.
4-M cache.
6.
2-M cache.
7.
At Tj of 100°C.
8.
At Tj of 50°C.
9.
At Tj of 35°C.
Datasheet
83