SGM2016AN 데이터 시트보기 (PDF) - Sony Semiconductor
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SGM2016AN Datasheet PDF : 5 Pages
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Package Outline
Unit: mm
SGM2016AN
M-281
2.0 ± 0.2
1.3
(0.65) (0.65)
3
2
4
1
+ 0.1
0.3 – 0.05
(0.65) (0.6)
1.25
+ 0.1
0.4 – 0.05
0.9 ± 0.1
0 ± 0.1
+ 0.1
0.1 – 0.01
1 : Source
2 : Gate 1
3 : Gate 2
4 : Drain
SONY CODE
EIAJ CODE
JEDEC CODE
M-281
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY RESIN
SOLDER PLATING
COPPER
0.1g
SGM2016AN
–5–
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