CXA1563M/S 데이터 시트보기 (PDF) - Sony Semiconductor
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CXA1563M/S Datasheet PDF : 15 Pages
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Package Outline
Unit: mm
CXA1563M
28PIN SOP (PLASTIC) 375mil
+ 0.4
18.8 – 0.1
28
15
+ 0.4
2.3 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
14
1.27
+ 0.1
0.2 – 0.05
± 0.12 M
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-28P-L04
∗SOP028-P-0375-D
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY / PHENOL RESIN
SOLDER PLATING
42 ALLOY
0.7g
CXA1563S
28
28PIN SDIP (PLASTIC) 400mil
+ 0.4
26.9 – 0.1
15
1
14
1.778
0° to 15°
0.5 ± 0.1
0.9 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-28P-01
SDIP028-P-0400-A
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
EPOXY RESIN
SOLDER PLATING
LEAD MATERIAL
COPPER / 42 ALLOY
PACKAGE WEIGHT
1.7g
– 15 –
CXA1563M/S
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