TGL6425-SCC 데이터 시트보기 (PDF) - TriQuint Semiconductor
부품명
상세내역
제조사
TGL6425-SCC Datasheet PDF : 7 Pages
| |||
TGL6425-SCC
MECHANICAL DRAWING
1,8288 (0.0720)
1,6358 (0.0644)
2
3
4
5
6
1,0592 (0.0417)
1
7
1,0592 (0.0417)
0,1880 (0.0074)
0.0
12
11
10
9
8
Units: Millimeters (inches)
Thickness: 0,102 (0.004) (reference only)
Chip edge to bond pad dimensions are shown to center of bond pad.
Chip size ±0,0508 (0.002)
Bond pad #1 (RF In): 0,127 x 0,207 (0.0050 x 0.0082)
Bond pad #2 (V1):
Bond pad #3 (V3):
Bond pad #4 (V2):
Bond pad #5 (V5):
Bond pad #6 (V10):
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
Bond pad #7 (RF Out): 0,246 x 0,119 (0.0097 x 0.0047)
Bond pad #8 (V4):
Bond pad #9 (V7):
Bond pad 1#0 (V6):
Bond pad #11 (V8):
Bond pad #12 (V9):
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
0,120 x 0,120 (0.0047 x 0.0047)
6
TriQuint Semiconductor, Inc. • Texas Facilities • (972) 995-8465 • www.triquint.com
Share Link: 