WM9711LGEFL/RV(2006) 데이터 시트보기 (PDF) - Wolfson Microelectronics plc

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WM9711LGEFL/RV
(Rev.:2006)

Low Power Audio CODEC for Portable Applications

Wolfson Microelectronics plc 

WM9711L

PACKAGE DRAWING

FL: 48 PIN QFN PLASTIC PACKAGE 7 X 7 X 0.9 mm BODY, 0.50 mm LEAD PITCH

D2

SEE DETAIL 1

D

D2/2

37

48

L

INDEX AREA

36

1

(D/2 X E/2)

EXPOSED

GROUND 6

PADDLE

E2/2

E2

SEE DETAIL 2

Production Data

DM029.E

E

25

24

e

BOTTOM VIEW

12

13

b

2X

aaa C

2X

aaa C

TOP VIEW

(A3)

A

C SEATING PLANE

SIDE VIEW

A1

DETAIL 3

W

(A3)

b

Exposed lead

T

H

G

Half etch tie bar

DETAIL 3

ccc C

0.08 C

DETAIL 1

R = 0.3MM

EXPOSED

GROUND

PADDLE

DETAIL 2

Datum

R

Symbols

A

A1

A3

b

D

D2

E

E2

e

G

H

L

T

W

aaa

bbb

ccc

REF

Dimensions (mm)

MIN

NOM

MAX

NOTE

0.80

0.90

1.00

0

0.02

0.05

0.20 REF

0.18

0.25

0.30

1

7.00 BSC

5.00

5.15

5.25

7.00 BSC

5.00

5.15

5.25

0.5 BSC

0.213

0.1

0.30

0.4

0.50

0.1

0.2

Tolerances of Form and Position

0.15

0.10

0.10

JEDEC, MO-220, VARIATION VKKD-2

Terminal

tip

e/2

e

NOTES:

1. DIMENSION b APPLIED TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.

2. ALL DIMENSIONS ARE IN MILLIMETRES

3. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-002.

4. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.

5. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

6. REFER TO APPLICATION NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.

w

PD Rev 4.3 August 2006

64

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