
VNQ830
Package and PCB thermal data
Figure 28. Rthj-amb vs PCB copper area in open box free air condition
RTHj_am b
(°C/W)
70
60
50
RthA
40
) 30
t(s 20
duc 10
Pro 0
RthB
RthC
1
2
3
4
5
6
7
PCB Cu heatsink area (cm ^2)/island
solete Figure 29. Thermal impedance junction ambient single pulse
Ob ZTH (°C/W)
- 1000
duct(s) 100
Obsolete Pro 10
Footprint
2
6 cm
1
0.1
0.0001 0.001 0.01
0.1
1
Time (s)
10 100 1000
Doc ID 7390 Rev 5
23/28