UPD168111AMA-6A5 데이터 시트보기 (PDF) - NEC => Renesas Technology

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UPD168111AMA-6A5

MICROSTEP DRIVER FOR DRIVING CAMERA LENS

NEC => Renesas Technology 

µ PD168111A

RECOMMENDED SOLDERING CONDITIONS

The µPD168111A should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Recommended Soldering Conditions for Surface Mounting Type

µPD168111AMA-6A5-A: 24-pin plastic TSSOP (5.72 mm (225))

Soldering Method

Soldering Conditions

Recommended

Condition

Symbol

Infrared reflow

Package peak temperature: 260°C, Time: 60 seconds MAX. (at 220°C

or higher), Count: Three times or less, Exposure limit: None, Flux:

Rosin flux with low chlorine (0.2 Wt% or below) recommended

IR60-00-3

Caution Do not use different soldering methods together (except for partial heating).

Data Sheet D16536EJ1V0DS

37

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