TJA1040 데이터 시트보기 (PDF) - Philips Electronics

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TJA1040

High speed CAN transceiver

Philips Electronics 

Philips Semiconductors

High speed CAN transceiver

Bare die  All die are tested and are guaranteed to

comply with all data sheet limits up to the point of wafer

sawing for a period of ninety (90) days from the date of

Philips' delivery. If there are data sheet limits not

guaranteed, these will be separately indicated in the data

sheet. There are no post packing tests performed on

individual die or wafer. Philips Semiconductors has no

control of third party procedures in the sawing, handling,

packing or assembly of the die. Accordingly, Philips

Semiconductors assumes no liability for device

functionality or performance of the die or systems after

third party sawing, handling, packing or assembly of the

die. It is the responsibility of the customer to test and

qualify their application in which the die is used.

Product specification

TJA1040

2003 Oct 14

16

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