TJA1040 데이터 시트보기 (PDF) - Philips Electronics
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TJA1040 Datasheet PDF : 22 Pages
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Philips Semiconductors
High speed CAN transceiver
Product specification
TJA1040
BONDING PAD LOCATIONS
SYMBOL
TXD
GND
VCC
RXD
SPLIT
CANL
CANH
STB
PAD
1
2
3
4
5
6
7
8
COORDINATES(1)
x
y
119.5
648.5
1 214.25
1 635.25
1 516.5
990.5
530.25
113.75
114.5
85
114.5
114.5
1 275
1 273.75
1 273.75
1 246
Note
1. All x/y coordinates represent the position of the centre
of each pad (in µm) with respect to the left hand
bottom corner of the top aluminium layer (see Fig.9).
handbook, halfpage 8
7
6
5
TJA1040U
test pad 1
test pad 2
x
01
0
2
3
4
MBL584
y
The backside of the bare die must be connected to ground.
Fig.9 Bonding pad locations.
2003 Oct 14
11
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