TEA5712T 데이터 시트보기 (PDF) - Philips Electronics

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TEA5712T

AM/FM stereo DTS radio circuit

Philips Electronics 

Philips Semiconductors

AM/FM stereo DTS radio circuit

Product specification

TEA5712; TEA5712T

SOLDERING

Plastic dual in-line packages

BY DIP OR WAVE

The maximum permissible temperature of the solder is

260 °C; this temperature must not be in contact with the

joint for more than 5 s. The total contact time of successive

solder waves must not exceed 5 s.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified storage maximum. If the printed-circuit board has

been pre-heated, forced cooling may be necessary

immediately after soldering to keep the temperature within

the permissible limit.

REPAIRING SOLDERED JOINTS

Apply the soldering iron below the seating plane (or not

more than 2 mm above it). If its temperature is below

300 °C, it must not be in contact for more than 10 s; if

between 300 and 400 °C, for not more than 5 s.

Plastic small-outline packages

BY WAVE

During placement and before soldering, the component

must be fixed with a droplet of adhesive. After curing the

adhesive, the component can be soldered. The adhesive

can be applied by screen printing, pin transfer or syringe

dispensing.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder bath is

10 s, if allowed to cool to less than 150 °C within 6 s.

Typical dwell time is 4 s at 250 °C.

A modified wave soldering technique is recommended

using two solder waves (dual-wave), in which a turbulent

wave with high upward pressure is followed by a smooth

laminar wave. Using a mildly-activated flux eliminates the

need for removal of corrosive residues in most

applications.

BY SOLDER PASTE REFLOW

Reflow soldering requires the solder paste (a suspension

of fine solder particles, flux and binding agent) to be

applied to the substrate by screen printing, stencilling or

pressure-syringe dispensing before device placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt, infrared, and

vapour-phase reflow. Dwell times vary between 50 and

300 s according to method. Typical reflow temperatures

range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 min. at 45 °C.

REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING

IRON OR PULSE-HEATED SOLDER TOOL)

Fix the component by first soldering two, diagonally

opposite, end pins. Apply the heating tool to the flat part of

the pin only. Contact time must be limited to 10 s at up to

300 °C. When using proper tools, all other pins can be

soldered in one operation within 2 to 5 s at between 270

and 320 °C. (Pulse-heated soldering is not recommended

for SO packages.)

For pulse-heated solder tool (resistance) soldering of VSO

packages, solder is applied to the substrate by dipping or

by an extra thick tin/lead plating before package

placement.

September 1994

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