TAT7461-EB 데이터 시트보기 (PDF) - TriQuint Semiconductor

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TAT7461-EB

75 Ω RF Amplifier

TriQuint Semiconductor 

TAT7461

75 Ω RF Amplifier

Mounting Configuration

Notes:

1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35 mm (#80/.0135”) diameter drill and

have a final, plated thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.

3. RF trace width depends upon the PC board material and construction.

4. All dimensions are in millimeters (inches). Angles are in degrees.

Product Compliance Information

ESD Information

ESD Rating:

Value:

Test:

Standard:

ESD Rating:

Value:

Test:

Standard:

Class 1 A

Passes ≥ 450 V min.

Human Body Model (HBM)

JEDEC Standard JESD22-A114

Class IV

Passes ≥ 1000 V min.

Charged Device Model (CDM)

JEDEC Standard JESD22-C101

MSL Rating

Level 3 at +260 °C convection reflow.

The part is rated Moisture Sensitivity Level 3 at 260 °C per

JEDEC standard IPC/JEDEC J-STD-020.

Solderability

Compatible with the latest version of J-STD-020, Lead

free solder, 260 °C.

This part is compliant with EU 2002/95/EC RoHS

directive (Restrictions on the Use of Certain Hazardous

Substances in Electrical and Electronic Equipment).

Preliminary Data Sheet: Rev C 04/30/10

© 2010 TriQuint Semiconductor, Inc.

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Disclaimer: Subject to change without noticee

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