STA3005 데이터 시트보기 (PDF) - STMicroelectronics

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STA3005

Dual-IF AM/FM digital radio receiver

STMicroelectronics 

STA3005

Package informations

Package informations

In order to meet environmental requirements, ST offers this device in ECOPACK® packages.

These packages have a Lead-free second level interconnect. The category of second level

Interconnect is marked on the package and on the inner box label, in compliance with

JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also

marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 1. TQFP144 Mechanical Data & Package Dimensions

mm

inch

DIM.

MIN. TYP. MAX. MIN. TYP. MAX.

A

1.20

0.047

A1 0.05

0.15 0.002

0.006

A2 0.95 1.00 1.05 0.037 0.039 0.041

B 0.17 0.22 0.27 0.007 0.009 0.011

C 0.09

0.20 0.003

0.008

D 21.80 22.00 22.20 0.858 0.866 0.874

D1 19.80 20.00 20.20 0.779 0.787 0.795

D2 2.00

0.079

D3

17.50

0.689

e

0.50

0.020

E 21.80 22.00 22.20 0.858 0.866 0.874

E1 19.80 20.00 20.20 0.779 0.787 0.795

E2 2.00

0.079

E3

17.50

0.689

L 0.45 0.60 0.75 0.018 0.024 0.030

L1

1.00

0.0393

K

3.5˚ (min.), 7˚(max.)

ccc

0.08

0.03

Note 1: Exact shape of each corner is optional.

OUTLINE AND

MECHANICAL DATA

TQFP144

(20x20x1.0mm exposed Pad Down)

7386636

3/5

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