SI4735-D60-GUR 데이터 시트보기 (PDF) - Silicon Laboratories

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SI4735-D60-GUR

BROADCAST AM/FM/SW/LW RADIO RECEIVER

Silicon Laboratories 

Si4730/31/34/35-D60

8.2. Si473x-D60 SSOP

Figure 15 illustrates the PCB land pattern details for the Si473x-D60-GU SSOP. Table 20 lists the values for the

dimensions shown in the illustration.

Figure 15. PCB Land Pattern

Table 20. PCB Land Pattern Dimensions

Dimension

C

E

Min

Max

5.20

5.30

0.635 BSC

X

0.30

0.40

Y1

1.50

1.60

General:

1. All dimensions shown are in millimeters (mm) unless otherwise noted.

2. This land pattern design is based on the IPC-7351 guidelines.

Solder Mask Design:

3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the

solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.

Stencil Design:

4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should

be used to assure good solder paste release.

5. The stencil thickness should be 0.125 mm (5 mils).

6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.

Card Assembly:

7. A No-Clean, Type-3 solder paste is recommended.

8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification

for Small Body Components.

38

Rev. 1.1

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