NCV4276BDS33R4G 데이터 시트보기 (PDF) - ON Semiconductor
부품명
상세내역
제조사
NCV4276BDS33R4G Datasheet PDF : 18 Pages
| |||
NCV4276B
Table 1. PIN FUNCTION DESCRIPTION
Pin No. Symbol
Description
1
I
Input; Battery Supply Input Voltage.
2
INH
Inhibit; Set low-to inhibit.
3
GND
Ground; Pin 3 internally connected to heatsink.
4
NC/VA Not connected for fixed voltage version/Voltage Adjust Input for adjustable voltage version; use an external
voltage divider to set the output voltage
5
Q
Output: Bypass with a capacitor to GND. See Figures 3 to 7 and Regulator Stability Considerations section.
Table 2. MAXIMUM RATINGS*
Rating
Symbol
Min
Max
Unit
Input Voltage
Input Peak Transient Voltage
Inhibit INH Voltage
Voltage Adjust Input VA
Output Voltage
Ground Current
Input Voltage Operating Range
VI
−42
45
V
VI
−
45
V
VINH
−42
45
V
VVA
−0.3
10
V
VQ
−1.0
40
V
Iq
−
100
mA
VI
VQ + 0.5 V or 4.5 V
40
V
(Note 1)
ESD Susceptibility
(Human Body Model)
−
4.0
−
kV
(Machine Model)
−
250
−
V
(Charged Device Model)
−
1.25
−
kV
Junction Temperature
TJ
−40
150
°C
Storage Temperature
Tstg
−50
150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*During the voltage range which exceeds the maximum tested voltage of I, operation is assured, but not specified. Wider limits may apply. Thermal
dissipation must be observed closely.
1. Minimum VI = 4.5 V or (VQ + 0.5 V), whichever is higher.
Table 3. LEAD TEMPERATURE SOLDERING REFLOW (Note 2)
Lead Temperature Soldering
Reflow (SMD styles only), Leaded, 60−150 s above 183, 30 s max at peak
Reflow (SMD styles only), Lead Free, 60−150 s above 217, 40 s max at peak
Wave Solder (through hole styles only), 12 sec max
2. Per IPC/JEDEC J−STD−020C.
TSLD
−
−
−
°C
240
265
310
Table 4. THERMAL CHARACTERISTICS (Notes 3 and 4)
Characteristic
Test Conditions (Typical Value)
Unit
DPAK 5-PIN PACKAGE
Min Pad Board (Note 5)
1, Pad Board (Note 6)
Junction-to-Tab (psi-JLx, yJLx)
Junction-to-Ambient (RqJA, qJA)
D2PAK 5-PIN PACKAGE
4.2
100.9
4.7
C/W
46.8
C/W
0.4 sq. in. Spreader Board (Note 7)
1.2 sq. in. Spreader Board (Note 8)
Junction-to-Tab (psi-JLx, yJLx)
3.8
Junction-to-Ambient (RqJA, qJA)
74.8
3. Minimum VI = 4.5 V or (VQ + 0.5 V), whichever is higher.
4. Per IPC/JEDEC J−STD−020C.
5. 1 oz. copper, 0.26 inch2 (168 mm2) copper area, 0.062″ thick FR4.
6. 1 oz. copper, 1.14 inch2 (736 mm2) copper area, 0.062″ thick FR4.
7. 1 oz. copper, 0.373 inch2 (241 mm2) copper area, 0.062″ thick FR4.
8. 1 oz. copper, 1.222 inch2 (788 mm2) copper area, 0.062″ thick FR4.
4.0
C/W
41.6
C/W
http://onsemi.com
3
Share Link: 