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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

NCP5623C 데이터 시트보기 (PDF) - ON Semiconductor

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NCP5623C Datasheet PDF : 11 Pages
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NCP5623C
MAXIMUM RATINGS
Symbol
Rating
Value
Unit
VBAT
Vout
Power Supply (see Figure 3)
Output Power Supply
0.3 < Vbat < 7.0
V
7.0
V
SDA, SCL,
SHDI2C
Digital Input Voltage
Digital Input Current
0.3 < V < VBAT
V
1
mA
ESD
Human Body Model: R = 1500 W, C = 100 pF (Note 3)
Machine Model
2
kV
200
V
PD
RqJC
RqJA
TA
TJ
TJmax
Tstg
LLGA12 package
Power Dissipation @ TA = +85°C (Note 4)
Thermal Resistance Junction to Case
Thermal Resistance Junction to Air
Operating Ambient Temperature Range
Operating Junction Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Latchup current maximum rating per JEDEC standard: JESD78.
200
51
200
40 to +85
40 to +125
+150
65 to +150
±100
mW
°C/W
°C/W
°C
°C
°C
°C
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM) ±2.0 kV per JEDEC standard: JESD22A114
Machine Model (MM) ±200 V per JEDEC standard: JESD22A115.
4. The maximum package power dissipation limit must not be exceeded.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: JSTD020A.
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