MAX7370 데이터 시트보기 (PDF) - Maxim Integrated

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MAX7370

8 x 8 Key-Switch Controller and LED Driver/GPIOs with I2C Interface and High Level of ESD Protection

Maxim Integrated 

MAX7370

8 x 8 Key-Switch Controller and LED Driver/GPIOs

with I2C Interface and High Level of ESD Protection

Wafer-Level Packaging (WLP)

Applications Information

For the latest application details on WLP construction,

dimensions, tape-carrier information, PCB techniques,

bump-pad layout, and recommended reflow tempera-

ture profile, as well as the latest information on reli-

ability testing results, refer to Application Note 1891:

Wafer-Level Packaging (WLP) and Its Applications,

available at www.maxim-ic.com.

Package Information

For the latest package outline information and land patterns

(footprints), go to www.maxim-ic.com/packages. Note that a

“+”, “#”, or “-” in the package code indicates RoHS status only.

Package drawings may show a different suffix character, but

the drawing pertains to the package regardless of RoHS status.

PACKAGE

TYPE

PACKAGE OUTLINE

LAND

CODE

NO.

PATTERN NO.

24 TQFN-EP T243A3+1 21-0188

90-0122

25 WLP

W252F2+1 21-0453

Refer to

Application

Note 1891

PROCESS: BiCMOS

Chip Information

Ordering Information

PART

MAX7370ETG+

MAX7370EWA+**

TEMP RANGE

-40NC to +85NC

-40NC to +85NC

PIN-PACKAGE

24 TQFN-EP*

25 WLP

+Denotes a lead(Pb)-free/RoHS-compliant package.

*EP = Exposed. pad.

**Future product—contact factory for availability.

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