MAX5478EUD 데이터 시트보기 (PDF) - Maxim Integrated

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MAX5478EUD

Dual, 256-Tap, Nonvolatile, I2C-Interface, Digital Potentiometers

Maxim Integrated 

Dual, 256-Tap, Nonvolatile, I2C-Interface,

Digital Potentiometers

ABSOLUTE MAXIMUM RATINGS

SDA, SCL, VDD to GND .........................................-0.3V to +6.0V

All Other Pins to GND.................................-0.3V to (VDD + 0.3V)

Maximum Continuous Current into H_, L_, and W_

MAX5477......................................................................±5.0mA

MAX5478......................................................................±1.3mA

MAX5479......................................................................±0.6mA

Continuous Power Dissipation (TA = +70°C)

16-Pin TQFN (derate 17.5mW/°C above +70°C) .......1398mW

14-Pin TSSOP (derate 9.1mW/°C above +70°C) .........727mW

Operating Temperature Range ...........................-40°C to +85°C

Maximum Junction Temperature .....................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

TQFN

Junction-to-Ambient Thermal Resistance (θJA) ........57.2°C/W

Junction-to-Case Thermal Resistance (θJC) ................40°C/W

TSSOP

Junction-to-Ambient Thermal Resistance (θJA) ......100.4°C/W

Junction-to-Case Thermal Resistance (θJC) ................30°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

ELECTRICAL CHARACTERISTICS

(VDD = +2.7V to +5.25V, H_ = VDD, L_ = GND, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VDD = +5V,

TA = +25°C.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

DC PERFORMANCE (VOLTAGE-DIVIDER MODE)

Resolution

256

Integral Nonlinearity

INL

(Note 3)

Differential Nonlinearity

DNL (Note 3)

Dual Code Matching

R0 and R1 set to same code (all codes)

TYP

MAX UNITS

±1

±0.5

±1

Taps

LSB

LSB

LSB

End-to-End Resistance

Temperature Coefficient

TCR

70

ppm/°C

Ratiometric Resistance

Temperature Coefficient

10

ppm/°C

MAX5477

Full-Scale Error

MAX5478

MAX5479

MAX5477

Zero-Scale Error

MAX5478

MAX5479

DC PERFORMANCE (VARIABLE-RESISTOR MODE)

Integral Nonlinearity (Note 4)

INL

VDD = 3V

VDD = 5V

MAX5477

Differential Nonlinearity (Note 4)

DNL MAX5478

MAX5479

-4

-0.6

LSB

-0.3

4

0.6

LSB

0.3

±3

LSB

±1.5

±1

±1

LSB

±1

2 _______________________________________________________________________________________

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