AMD 2-/3-Output Mobile Serial
VID Controller
VDDNB
SPLIT CORE
CPU SOCKET
VCORE0
VCORE1
COUT
COUT
KELVIN-SENSE VIAS UNDER THE INDUCTOR
COUT
COUT
(REFER TO EVALUATION KIT)
INDUCTOR
INDUCTOR
CIN
CIN
POWER
CIN
GROUND
CIN
RNTC
CSP
R2
CSN
R1
KELVIN-SENSE VIAS TO
INDUCTOR PAD
INDUCTOR DCR SENSING
CVCC
CSP
CSN
CEQ
+
CONNECT THE EXPOSED
PAD TO POWER GND
USING MULTIPLE VIAS
L3
COUT3
AGND PIN
Figure 14. PCB Layout Example
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