MAS9279A3TG00 데이터 시트보기 (PDF) - Micro Analog systems
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MAS9279A3TG00 Datasheet PDF : 10 Pages
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SOLDERING INFORMATION
DA9279.003
13 July 2006
Resistance to Soldering Heat
Maximum Temperature
Maximum Number of Reflow Cycles
Reflow profile
Seating Plane Co-planarity
Lead Finish
According to RSH test IEC 68-2-58/20
260°C
3
Thermal profile parameters stated in JESD22-A113 should not
be exceeded. http://www.jedec.org
max 0.08 mm
Solder plate 7.62 - 25.4 µm, material Matte Tin
EMBOSSED TAPE SPECIFICATIONS
4.0 +/- 0.1
1.37 +/- 0.1
3.23 +/- 0.1
ORIENTATION ON TAPE
USER FEED DIRECTION
4.0 +/- 0.1
0.254 +/-0.02
7 (10)
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