
Package Outline
Unit: mm
10.6 ± 0.3
V
H
22 pin DIP (400mil)
55.7 ± 0.3
36.05 (7µm X 5150pixels)
22
12
No.1 Pixel
1
11
∗53.00 or 54.2
2.54
0.51
0.3 M
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
DRAWING NUMBER
Plastic, Ceramic
GOLD PLATING
42 ALLOY
5.43g
LS-B23-01(E)
1. The height from the bottom to the sensor surface is 2.38 ± 0.3mm.
2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.
∗ The dimension of cover glass is 54.2 × 9.0mm or 53.0 × 7.3mm.