LTC2240CUP-12-TRPBF(RevB) 데이터 시트보기 (PDF) - Linear Technology

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LTC2240CUP-12-TRPBF
(Rev.:RevB)

12-Bit, 170Msps ADC

Linear Technology 

PACKAGE DESCRIPTION

UP Package

64-Lead Plastic QFN (9mm × 9mm)

(Reference LTC DWG # 05-08-1705)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.70 ±0.05

LTC2240-12

7.15 ±0.05

(4 SIDES)

8.10 ±0.05

9.50 ±0.05

NOTE:

1. DRAWING CONFORMS TO JEDEC PACKAGE

OUTLINE MO-220 VARIATION WNJR-5

2. ALL DIMENSIONS ARE IN MILLIMETERS

3. DIMENSIONS OF EXPOSED PAD ON BOTTOM

OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT,

SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT

4. EXPOSED PAD SHALL BE SOLDER PLATED

5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1

LOCATION ON THE TOP AND BOTTOM OF PACKAGE

6. DRAWING NOT TO SCALE

9 .00 ± 0.10

(4 SIDES)

PIN 1 TOP MARK

(SEE NOTE 5)

0.25 ±0.05

0.50 BSC

PACKAGE OUTLINE

0.75 ± 0.05

7.15 ± 0.10

(4-SIDES)

BOTTOM VIEW—EXPOSED PAD

R = 0.115

TYP

63 64

PIN 1

CHAMFER

0.40 ± 0.10

1

2

0.200 REF

0.00 – 0.05

(UP64) QFN 1003

0.25 ± 0.05

0.50 BSC

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

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