LTC2237IUH 데이터 시트보기 (PDF) - Linear Technology

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LTC2237IUH

10-Bit, 65/40/25Msps Low Noise 3V ADCs

Linear Technology 

PACKAGE DESCRIPTIO

LTC2238/LTC2237/LTC2236

UH Package

32-Lead Plastic QFN (5mm × 5mm)

(Reference LTC DWG # 05-08-1693)

5.50 ±0.05

4.10 ±0.05

3.45 ±0.05

(4 SIDES)

0.70 ±0.05

0.25 ± 0.05

0.50 BSC

RECOMMENDED SOLDER PAD LAYOUT

5.00 ± 0.10

(4 SIDES)

PIN 1

TOP MARK

(NOTE 6)

PACKAGE OUTLINE

0.75 ± 0.05

0.00 – 0.05

3.45 ± 0.10

(4-SIDES)

BOTTOM VIEW—EXPOSED PAD

0.23 TYP

R = 0.115

(4 SIDES)

TYP

31 32

0.40 ± 0.10

1

2

0.200 REF

NOTE:

1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE

M0-220 VARIATION WHHD-(X) (TO BE APPROVED)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

0.25 ± 0.05

0.50 BSC

(UH) QFN 0603

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

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