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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

IS61SP25618-133TQ 데이터 시트보기 (PDF) - Integrated Silicon Solution

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IS61SP25618-133TQ
ISSI
Integrated Silicon Solution 
IS61SP25618-133TQ Datasheet PDF : 15 Pages
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IS61SP25616
IS61SP25618
INTERLEAVED BURST ADDRESS TABLE (MODE = VCC or No Connect)
External Address
A1 A0
00
01
10
11
1st Burst Address
A1 A0
01
00
11
10
2nd Burst Address
A1 A0
10
11
00
01
3rd Burst Address
A1 A0
11
10
01
00
ISSI ®
LINEAR BURST ADDRESS TABLE (MODE = GND)
0,0
A1', A0' = 1,1
0,1
1,0
ABSOLUTE MAXIMUM RATINGS(1)
Symbol Parameter
Value
Unit
TBIAS
Temperature Under Bias
40 to +85
°C
TSTG
Storage Temperature
55 to +150
°C
PD
Power Dissipation
1.6
W
IOUT
Output Current (per I/O)
100
mA
VIN, VOUT Voltage Relative to GND for I/O Pins 0.5 to VCCQ + 0.3 V
VIN
Voltage Relative to GND for
for Address and Control Inputs
0.5 to VCC + 0.5 V
VCC
Voltage on Vcc Supply Relatiive to GND 0.5 to 4.6
V
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause perma-
nent damage to the device. This is a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
2. This device contains circuitry to protect the inputs against damage due to high static voltages
or electric fields; however, precautions may be taken to avoid application of any voltage higher
than maximum rated voltages to this high-impedance circuit.
3. This device contains circuitry that will ensure the output devices are in High-Z at power up.
6
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
04/17/01

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