IRFBC30S/L
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
V(BR)DSS Drain-to-Source Breakdown Voltage
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
Gate Threshold Voltage
gfs
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
LS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Min. Typ. Max. Units
Conditions
600 ––– ––– V VGS = 0V, ID = 250µA
––– 0.62 ––– V/°C Reference to 25°C, ID =1mA
––– ––– 2.2 Ω VGS =10V, ID =2.2A
2.0 ––– 4.0 V VDS = VGS, ID = 250µA
2.5 ––– ––– S VDS = 50V, ID = 2.2A
––– ––– 100 µA VDS = 600V, VGS = 0V
––– ––– 500
VDS = 480V, VGS = 0V, TJ = 125°C
––– ––– 100 nA VGS = 20V
––– ––– -100
VGS = -20V
––– ––– 31
ID = 3.6A
––– ––– 4.6
––– ––– 17
nC VDS = 360V
VGS = 10V, See Fig. 6 and 13
––– 11 –––
VDD = 300V
––– 13 ––– ns ID = 3.6A
––– 35 –––
RG = 12Ω
––– 14 –––
RD =82Ω, See Fig. 10
Between lead,
––– 7.5 ––– nH and center of die contact
––– 660 –––
VGS = 0V
––– 86 ––– pF VDS = 25V
––– 19 –––
ƒ = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode)
V SD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
––– ––– 3.6 A showing the
integral reverse
G
––– ––– 14
p-n junction diode.
S
––– ––– 1.6 V TJ = 25°C, IS =3.6A, VGS = 0V
––– 370 810 ns TJ = 25°C, IF =3.6A
––– 2.0 4.2 µC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
VDD =50V, starting TJ = 25°C, L =41mH
RG = 25Ω, IAS = 3.6A. (See Figure 12)
ISD ≤ 3.6A, di/dt ≤ 60A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 150°C
Pulse width ≤ 3000µs; duty cycle ≤ 2%.
Uses IRFBC30 data and test conditions
** When mounted on 1" square PCB (FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.