HI-318X PACKAGE DIMENSIONS
28-PIN CERAMIC LEADLESS CHIP CARRIER
inches (millimeters)
Package Type: 28S
.020
(.508)
INDEX
PIN 1
.080 ±.020
(2.032 ±.508)
.451 ±.009
(11.455 ±.229)
SQ.
.040 x 45° 3PLS
(1.016 x 45° 3PLS)
.050
(1.270)
BSC
.008R ± .006
(.203R ±.152)
PIN 1
.050 ±.005
(1.270 ±.127)
.025 ±.003
(.635 ±.076)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
32-PIN J-LEAD CERQUAD
inches (millimeters)
Package Type: 32U
31
.450 ±.008
32
1
2
.488 ±.008
(12.395 ±.203)
(11.430 ±.203)
.420 ±.012
(10.668 ±.305)
.040
(1.016)
typ
.588 ±.008
(14.935 ±.203)
.550 ± .009
(13.970 ± .229)
.190 max
(4.826)
.019 ± .003
(.483 ± .076)
.050 BSC
(1.270)
.520 ±.012
(13.208 ±.305)
.083 ±.009
(2.108 ±.229)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
HOLT INTEGRATED CIRCUITS
12