HCS139D 데이터 시트보기 (PDF) - Intersil

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HCS139D

Radiation Hardened Dual 2-to-4 Line Decoder/Demultiplexer

Intersil 

Die Characteristics

DIE DIMENSIONS:

106 mils x 108 mils x 19 mils 1 mils

METALLIZATION:

Type: SiAl

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCS139MS

HCS139MS

1A1 (3)

1Y0 (4)

1Y1 (5)

1Y2 (6)

(14) 2A0

(13) 2A1

(12) 2Y0

(11) 2Y1

(10) 2Y2

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCS139 is TA14309A.

Spec Number 518832

161

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