HCC4001BK 데이터 시트보기 (PDF) - STMicroelectronics

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HCC4001BK

Rad-hard high voltage CMOS logic series

STMicroelectronics 

Package mechanical data

Table 8. Ceramic Flat-24 package dimensions

mm

Dim

Min

Typ

A

10.70

11.00

B

15.30

15.49

C

1.45

D

0.23

0.254

E

13.84

13.97

F

1.22

1.27

G

0.45

0.508

H

7.25

L

25.00

M

0.45

0.508

N

7.01

Figure 6. Ceramic Flat-24 package drawings

HCC4xxx

Max

11.30

15.70

1.90

0.30

14.10

1.32

0.55

8.25

28.00

0.55

Note:

14/24

The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the

package. Connecting unused pins or metal lid to ground or to the power supply will not affect

the electrical characteristics.

Doc ID 17102 Rev 3

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