GS-R12FP0501.9 데이터 시트보기 (PDF) - STMicroelectronics
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GS-R12FP0501.9 Datasheet PDF : 14 Pages
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GS-R12FP
Application information
4.9
Soldering
Soldering phase has to be execute with care : in order to avoid undesired melting
phenomenon, particular attention has to be take on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on
IPC/JEDEC J-STD-020C ,July 2004 recommendations.
Table 7.
Soldering
Profile feature
Average ramp up rate ( TSMAX to TP)
Preheat
Temperature min ( TS MIN)
Temperature max ( TS MAX)
Time (TS MIN to TS MAX) ( tS )
Time maintained above :
Temperature TL
Time tL
Peak temperature (TP)
Time within 5 °C of actual peak temperature (tP)
Ramp down rate
Time from 25 °C to peak temperature
PB free assembly
3 °C / sec max
150 °C
200 °C
60 – 100 sec
217 °C
40 – 70 sec
240 + 0 °C
10 – 20 sec
6 °C / sec
8 minutes max
Figure 3. Soldering
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