
AMP01
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
18-Lead Cerdip
(Q-18)
0.005 (0.13) MIN
0.098 (2.49) MAX
18
10
0.310 (7.87)
0.220 (5.59)
1
9
PIN 1
0.200 (5.08)
MAX
0.200 (5.08)
0.125 (3.18)
0.960 (24.38) MAX
0.060 (1.52)
0.015 (0.38)
0.150
(3.81)
MIN
0.023 (0.58)
0.014 (0.36)
0.100
(2.54)
BSC
0.070 (1.78) SEATING
0.030 (0.76) PLANE
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
15؇
0.008 (0.20)
0؇
28-Terminal Ceramic Leadless Chip Carrier
(E-28A)
0.100 (2.54)
0.064 (1.63)
0.075
(1.91)
REF
0.300 (7.62)
BSC
0.150
(3.51)
BSC
0.458 (11.63)
0.442 (11.23) 0.458
SQ (11.63)
MAX
SQ
0.095 (2.41) 26
4
0.075 (1.90)
25 28
5
1
0.011 (0.28)
0.007 (0.18)
R TYP
BOTTOM
VIEW
0.088 (2.24)
0.054 (1.37)
0.075
19
(1.91)
18
REF
0.055 (1.40)
0.045 (1.14)
12
11
0.200
(5.08)
BSC
0.015 (0.38)
MIN
0.028 (0.71)
0.022 (0.56)
0.050
(1.27)
BSC
45؇ TYP
20-Lead SOIC
(R-20)
0.5118 (13.00)
0.4961 (12.60)
20
11
1
10
PIN 1
0.1043 (2.65)
0.0926 (2.35)
0.0291 (0.74) ؋ 45؇
0.0098 (0.25)
0.0118 (0.30)
0.0040 (0.10)
8؇ 0.0500 (1.27)
0.0500 0.0192 (0.49)
(1.27) 0.0138 (0.35)
BSC
SEATING
PLANE
0؇
0.0125 (0.32)
0.0091 (0.23)
0.0157 (0.40)
–22–
REV. D