Electrical Characteristics (continued)
TA = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Type Min Typ Max Units
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
Q1
Q2
VSD
Drain-Source Diode Forward VGS = 0 V,
IS = –1.3 A (Note 2) Q1
Voltage
VGS = 0 V,
IS = 1.3 A (Note 2) Q2
trr
Diode Reverse Recovery
IF = – 4.2A,dIF/dt = 100 A/µs
Q1
Time
IF = 5.9A, dIF/dt = 100 A/µs
Q2
Qrr
Diode Reverse Recovery
IF = – 4.2A,dIF/dt = 100 A/µs
Q1
Charge
IF = 5.9A, dIF/dt = 100 A/µs
Q2
–1.3 A
1.3
–0.8 –1.2 V
0.7 1.2
17
nS
15
6
nC
4
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 68°C/W when
mounted on a 1in2 pad
of 2 oz copper (Single
Operation).
b) 102°C/W when mounted
on a minimum pad of 2 oz
copper (Single Operation).
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDC6020C RevB (W)