EMIF04-MMC3F2 데이터 시트보기 (PDF) - STMicroelectronics

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EMIF04-MMC3F2

4-line IPAD™, EMI filter including ESD protection

STMicroelectronics 

EMIF04-MMC02F2

3

Ordering information scheme

Ordering information scheme

Figure 10. Ordering information scheme

EMIF yy - xxx zz Fx

EMI Filter

Number of lines

Information

x = resistance value (Ohms)

z = capacitance value / 10(pF)

or

3 letters = application

2 digits = version

Package

F = Flip Chip

x = 2: Lead-free, pitch = 500 µm, bump = 315 µm

4

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

Figure 11. Flip Chip dimensions

500 µm ± 50

315 µm ± 50

650 µm ± 65

285 µm

1.57mm ± 50 µm

5/8

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