
Package Outline
Unit: mm
30PIN SSOP (PLASTIC)
∗9.7 ± 0.1
30
16
A
CXA2647N
+ 0.2
1.25 – 0.1
0.10
1
15
b
0.65
0.13 M
0.1 ± 0.1
b=0.22 ± 0.03
DETAIL B : PALLADIUM
0° to 10°
NOTE: Dimension "∗" does not include mold protrusion.
DETAIL A
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
SONY CODE
SSOP-30P-L01
LEAD TREATMENT
PALLADIUM PLATING
EIAJ CODE
P-SSOP30-5.6x9.7-0.65
LEAD MATERIAL
COPPER ALLOY
JEDEC CODE
PACKAGE MASS
0.1g
– 23 –
Sony Corporation