CS7054 데이터 시트보기 (PDF) - ON Semiconductor
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CS7054 Datasheet PDF : 12 Pages
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14
1
A
F
N
–T–
SEATING
PLANE
H
G
CS7054
PACKAGE DIMENSIONS
DIP–14
N SUFFIX
CASE 646–04
ISSUE M
8
B
7
L
C
K
J
D 14 PL
M
0.13 (0.005) M
D
A
16
9
SO–16L
DW SUFFIX
CASE 751G–03
ISSUE B
q
1
8
16X B
B
0.25 M T A S B S
14X e
SEATING
PLANE
T
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.715 0.740 18.16 18.80
B 0.240 0.260 6.10 6.60
C 0.160 0.180 4.06 4.57
D 0.015 0.020 0.38 0.51
F 0.040 0.060 1.02 1.52
G
0.100 BSC
2.54 BSC
H 0.052 0.072 1.32 1.83
J 0.008 0.012 0.20 0.30
K 0.115 0.135 2.92 3.43
L 0.290 0.310 7.37 7.87
M --- 10 _ --- 10 _
N 0.020 0.040 0.51 1.02
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 10.15 10.45
E 7.40 7.60
e
1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q
0_ 7_
PACKAGE THERMAL DATA
Parameter
RΘJC
RΘJA
Typical
Typical
DIP–14
48
85
SO–16L
23
105
Unit
°C/W
°C/W
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