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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

CNY17F3 데이터 시트보기 (PDF) - Fairchild Semiconductor

부품명
상세내역
제조사
CNY17F3
Fairchild
Fairchild Semiconductor 
CNY17F3 Datasheet PDF : 15 Pages
First Prev 11 12 13 14 15
White Package (-M Suffix)
Package Dimensions (Through Hole)
0.350 (8.89)
0.320 (8.13)
Pin 1 ID
0.260 (6.60)
0.240 (6.10)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
Pin 1 ID
0.390 (9.90)
0.260 (6.60) 0.332 (8.43)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.014 (0.36)
0.010 (0.25)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
0.320 (8.13)
15°
0.012 (0.30)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.012 (0.30)
0.008 (0.20)
0.100 [2.54]
0.035 (0.88)
0.012 (0.30)
Package Dimensions (0.4” Lead Spacing)
0.350 (8.89)
0.320 (8.13)
PIN 1 ID
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
0.012 (0.30)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
Recommended Pad Layout for
Surface Mount Leadform
(White Package Only)
0.070 (1.78)
0.060 (1.52)
0.425 (10.79)
0.100 (2.54)
0.305 (7.75)
0.030 (0.76)
NOTE
All dimensions are in inches (millimeters)
11
CNY17X, CNY17FX, MOC810X Rev. 1.0.5
www.fairchildsemi.com

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