L1387QMP/EGW
Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process."
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: DSAA4140
APPROVED :
REV NO: V.2
CHECKED :
DATE: OCT/17/2001
DRAWN: S.S. Wu
PAGE: 4 OF 4