ADT7420
Data Sheet
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
4.10
4.00 SQ
3.90
TOP VIEW
SIDE VIEW
0.65
BSC
0.45
0.40
0.35
0.35
0.30
0.25
13
12
16
1
EXPOSED
PAD
4
9
8
5
BOTTOM VIEW
DETAIL A
(JEDEC 95)
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
2.70
2.60 SQ
2.50
0.20 MIN
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
ORDERING GUIDE
Model 1
ADT7420UCPZ-R2
ADT7420UCPZ-RL7
EVAL-ADT7X20EBZ
1 Z = RoHS Compliant Part.
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.
Figure 21. 16-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-16-17)
Dimensions shown in millimeters
Operating Temperature Range
−40°C to +150°C
−40°C to +150°C
Package Description
16-lead LFCSP
16-lead LFCSP
Evaluation Board
Package Option
CP-16-17
CP-16-17
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2012–2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09013-0-9/17(A)
Rev. A | Page 24 of 24