ADP1706ACPZ-1.3-R7(RevA) 데이터 시트보기 (PDF) - Analog Devices
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ADP1706ACPZ-1.3-R7 Datasheet PDF : 20 Pages
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Data Sheet
PCB LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of the
ADP1706/ADP1707/ADP1708. However, as can be seen
from Table 7, a point of diminishing returns is eventually
reached, beyond which an increase in the copper size does
not yield significant heat dissipation benefits.
The ADP1706/ADP1707/ADP1708 feature an exposed pad
on the bottom of both the SOIC and LFCSP packages to
improve thermal performance. Because the exposed pad is
electrically connected to GND inside the package, it is
recommended that it also be connected to the ground
plane on the PCB with a sufficient amount of copper.
Here are a few general tips when designing PCBs:
• Place the input capacitor as close as possible to the IN
and GND pins.
• Place the output capacitor as close as possible to the
OUT and GND pins.
• For the ADP1706, place the soft start capacitor as
close as possible to the SS pin.
• Connect the load as close as possible to the OUT and
SENSE pins.
ADP1706/ADP1707/ADP1708
Use of 0402 or 0603 size capacitors and resistors achieves the
smallest possible footprint solution on boards where area is
limited.
ANALOG
DEVICES
ADP1706/ADP1707/ADP1708
SOIC8
GND
C1
C3
C2
GND
U1
R1
J1
R2
VIN
VOUT
GND
EN
ADJ/TRK/SS
GND
Figure 42. Example PCB Layout
Rev. A | Page 17 of 20
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