ADN4664
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
VCC to GND
Input Voltage (RINx+, RINx−) to GND
Output Voltage (ROUTx) to GND
Operating Temperature Range
Industrial Temperature Range
Storage Temperature Range
Junction Temperature (TJ max)
Power Dissipation
SOIC Package
θJA Thermal Impedance
Reflow Soldering Peak Temperature
Pb-Free
Rating
−0.3 V to +4 V
−0.3 V to VCC + 3.9 V
−0.3 V to VCC + 0.3 V
−40°C to +85°C
−65°C to +150°C
150°C
(TJ max − TA)/θJA
149.5°C/W
260°C ± 5°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. 0 | Page 6 of 12