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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

ADG3308 데이터 시트보기 (PDF) - Analog Devices

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ADG3308 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
ADG3308/ADG3308-1
BALL A1
IDENTIFIER
0.650
0.590
0.530
SEATING
PLANE
2.06
2.00
1.94
4
3
2
1
A
2.56
B
2.50
2.00 REF
2.44
C
D
TOP VIEW
(BALL SIDE DOWN)
SIDE VIEW
0.360
0.320
0.280
0.50
BSC
0.370
0.350
0.330
COPLANARITY
0.05
0.280
0.240
0.200
E
BOTTOM VIEW
(BALL SIDE UP)
1.50 REF
Figure 44. 20-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-20-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
ADG3308BRUZ
ADG3308BRUZ-REEL
ADG3308BRUZ-REEL7
ADG3308BCPZ-REEL
ADG3308BCPZ-REEL7
ADG3308BCBZ-1-RL7
ADG3308BCBZ-1-REEL
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Ball Wafer Level Chip Scale Package [WLCSP]
20-Ball Wafer Level Chip Scale Package [WLCSP]
1 Z = RoHS Compliant Part.
Data Sheet
Package Option
RU-20
RU-20
RU-20
CP-20-1
CP-20-1
CB-20-2
CB-20-2
©2005–2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04865-0-10/13(D)
Rev. D | Page 20 of 20

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