AD9889BBCPZ-80 데이터 시트보기 (PDF) - Analog Devices
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AD9889BBCPZ-80 Datasheet PDF : 12 Pages
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AD9889B
*1.40 MAX
6.10
6.00 SQ
5.90
BALL A1
PAD CORNER
TOP VIEW
DETAIL A
4.50
BSC SQ
0.50
BSC
0.75
REF
0.15 MIN
A1 CORNER
INDEX AREA
10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
BOTTOM VIEW
DETAIL A
0.65 MIN
0.35 SEATING
0.30 PLANE
0.25
BALL DIAMETER
COPLANARITY
0.08 MAX
*COMPLIANT TO JEDEC STANDARDS MO-225
WITH THE EXCEPTION TO PACKAGE HEIGHT.
Figure 7. 76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
6 mm × 6 mm × 1.4 mm
(BC-76)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD9889BBCPZ-801
AD9889BBCPZ-1651
AD9889BBSTZ-801
AD9889BBSTZ-1651
AD9889BBBCZ-801
AD9889BBBCZRL-801
AD9889BBBCZ-1651
AD9889B/PCB
Temperature Range
−25°C to +85°C
−25°C to +85°C
−25°C to +85°C
−25°C to +85°C
−25°C to +85°C
−25°C to +85°C
−25°C to +85°C
Package Description
64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
80-Lead Low Profile Quad Flat Package [LQFP]
80-Lead Low Profile Quad Flat Package [LQFP]
76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
76-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Evaluation Board
1 Z = RoHS Compliant Part.
Package Option
CP-64-1
CP-64-1
ST-80-2
ST-80-2
BC-76
BC-76
BC-76
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent
Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06291-0-4/07(0)
Rev. 0 | Page 12 of 12
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