AD8051ART-REEL7 데이터 시트보기 (PDF) - Analog Devices

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AD8051ART-REEL7

Low Cost, High Speed, Rail-to-Rail Amplifiers

Analog Devices 

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Supply Voltage

Internal Power Dissipation1

SOIC Packages

SOT-23 Package

MSOP Package

TSSOP Package

Input Voltage (Common Mode)

Differential Input Voltage

Output Short-Circuit Duration

Storage Temperature Range (R)

Operating Temperature Range (A Grade)

Lead Temperature (Soldering 10 sec)

Ratings

12.6 V

Observe power

derating curves

Observe power

derating curves

Observe power

derating curves

Observe power

derating curves

±VS

±2.5 V

Observe power

derating curves

−65°C to +150°C

−40°C to +125°C

300°C

1 See Table 5.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

Specification is for device in free air.

Table 5. Thermal Resistance

Package Type

θJA

8-Lead SOIC

125

5-Lead SOT-23

180

8-Lead MSOP

150

14-Lead SOIC

90

14-Lead TSSOP

120

Unit

°C/W

°C/W

°C/W

°C/W

°C/W

AD8051/AD8052/AD8054

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the

AD8051/AD8052/AD8054 is limited by the associated rise in

junction temperature. The maximum safe junction temperature

for plastic encapsulated devices is determined by the glass

transition temperature of the plastic, approximately 150°C.

Temporarily exceeding this limit can cause a shift in parametric

performance due to a change in the stresses exerted on the die

by the package. Exceeding a junction temperature of 175°C for

an extended period can result in device failure.

While the AD8051/AD8052/AD8054 are internally short-

circuit protected, this cannot be sufficient to guarantee that the

maximum junction temperature (150°C) is not exceeded under

all conditions. To ensure proper operation, it is necessary to

observe the maximum power derating curves.

2.5

2.0

SOIC-14

TSSOP-14

1.5

SOIC-8

1.0

MSOP-8

0.5

SOT-23-5

0

–55 –35 –15 5 15 35 55 75 95 115

AMBIENT TEMPERATURE (°C)

Figure 6. Maximum Power Dissipation vs.

Temperature for AD8051/AD8052/AD8054

ESD CAUTION

Rev. H | Page 9 of 24

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